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Elsyca assists companies in the electronics industry with engineering and optimization of electrochemical processes based on our simulation technology and hands-on expertise. Companies depend on Elsyca for the optimization of plating lines (macro-scale), over the product quality improvement w.r.t. plating uniformity (meso-scale), up to the micro-scale engineering of via/through-hole plating in printed circuit boards or the superfilling process in the semiconductor industry.
As in many industries, continuous monitoring and improvement of the production yield is also in the PCB industry a constant concern. One process that has a major influence on the yield is the copper plating. Variations in the copper thickness between different printed circuit boards on a rack but also over a single board need to be carefully controlled to stay within ever more stringent specifications.
With Elsyca's simulation technology and plating expertise, companies can now upfront foresee potential production risks that would influence the yield, and can take the necessary countermeasures. Elsyca can then further assist by designing passive (shielding) or active (steering current field) tooling that shapes the current density distribution in the tank in order to improve uniformity.
Elsyca works closely together with the equipment supplier and the PCB manufacturers and will use complementary numerical simulations for the improvement and optimization of the manufacturing equipment and production process.
The image above illustrates:
- Macro-scale copper thickness distribution over a 9x2 rack of boards
- Meso-scale pattern-dependent thickness distribution over one single board.
If you want to know more about what we can offer to electronic companies, please contact Robrecht Belis ( Robrecht.Belis@elsyca.com, +32 16 49 81 77)
More information can also be found on our website.
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